This innovation replaces the actively cooled thermal control system used in the SSADT program with a passive cooling solution that significantly improves system reliability while maintaining equivalent thermal performance. The old existing active cooling design contains more than 3,000 potential leak points, creating a substantial risk of coolant reaching the critical GaN MMIC devices and causing system failure. Peregrine’s redesigned passive thermal control system eliminates these leak sources near the GaN devices by relocating all liquid connections behind a protective cold wall, preventing coolant exposure to sensitive electronics. The new design is directly interchangeable with the current system and has been successfully manufactured and tested to provide equivalent performance. The innovation is now being adapted to support higher-power 2 W GaN MMIC devices, which generate approximately 1,040 W of waste heat per module, ensuring the system can meet evolving performance requirements while enhancing reliability.

Solid State Active Denial Technology SSADT – Thermo Pyrolytic Graphite (TPG) Cooling, Microchannel Cooling, & Phase Change Cooling